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Chemical Mechanical Polishing of Glass Substrate with α-Alumina-g-Polystyrene Sulfonic Acid Composite Abrasive
chemical mechanical polishing glass substrate α-alumina graft polymerization
2011/8/3
Abrasive is the one of key influencing factors during chemical mechanical polishing(CMP) process. Currently, α-Alumina (α-Al2O3) particle, as a kind of abrasive, has been widely used in CMP slurries, ...