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2017 International Conference on Sensors, Materials and Manufacturing (ICSMM 2017) will be held in Nanhua University, Chiayi, Taiwan during November 24-26, 2017. We strongly believe that ICSMM 2017 wi...
ASMC is the leading international technical conference for exploring solutions to improve the collective micro-electronics manufacturing expertise. The conference, with technical sponsorship from IEEE...
Reliable and scalable manufacturing of nanofabrics entails significant challenges. Scalable nano-manufacturing approaches that employ the use of lithographic masks in conjunction with nanofabrication ...
Non-planar surface may cause incorrect transfer of patterns during lithography. In today’s IC manufacturing, chemical mechanical polishing (CMP) is used for topographical planarization. Since polish r...
Researchers in the lab of MIT materials science professor Carl V. Thompson grew dense forests of crystalline carbon nanotubes on a metal surface at temperatures close to those characteristic of compu...
Purpose: This paper discusses the use of acceptance sampling technique as a practical tool for quality assurance applications to decide whether the lot is to be accepted or rejected. Design/methodol...
美国电子制造业联合会(NEMI)是一个工业联合会。它的使命是确保北美电子制造业供应链在全球的领导地位。其成员单位包括65个电子产品制造商、供应商、协会、政府机构和大学。NEMI为这些成员单位提供一个进行合作的良好环境,使他们能够共同预测未来技术的发展与商业需要情况,并研究出有效的发展应对措施。NEMI指引北美电子工业,并寻找技术和基础设施方面的差距。
A new and simple method for the preparation of electrochromic tungsten oxide film is presented. This novel approach can be realized by introducing a nanoporous textured polyacrylic acid (PAA) layer be...
The applicability of the various copper compositions to the production of thick-film microwave devices has been examined. The results of this work are presented in this paper. The paper presents crite...
This paper discusses considerations in formulation and manufacture of thick film inks. It deals with the components of thick film inks, their properties, functions, and manufacturing methods. The vehi...

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