搜索结果: 1-1 共查到“应用化学 copper surface”相关记录1条 . 查询时间(0.069 秒)
Stability study of passive film on copper surface as a function of anodic potential
Electrochemical impedance spectroscopy model circuits copper surface passive film transition stage interfaces diffusion coefficient
2011/4/6
Results for passive film formation and breakdown on copper disk electrodes in buffer solutions, pH 9.2 and 8.5, were reported earlier. The present studies were carried out in a buffer solution, pH 8.0...