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2017第五届3D集成低温接合国际研讨会（2017 5th International Workshop on Low Temperature Bonding for 3D Integration）(LTB-3D)
第五届 3D集成低温接合 国际研讨会
2017/3/30
This workshop will focus on low-temperature bonding technologies which realize novel device structure by heterogeneous material and device integration and lead to entirely new manufacturing approaches...