搜索结果: 1-3 共查到“光电检测技术 On-Chip”相关记录3条 . 查询时间(0.015 秒)
Optical I/O for Chip-to-Chip Interconnects on CMOS Platform
Optical interconnects Subsystem integration and techniques Photonic integrated circuits Polymer active devices Modulators Photodetectors
2015/5/22
Optical devices on a CMOS die and package for terabit computing are discussed.200Gbps transmission is accomplished with a 1x10 VCSEL array. CMOS backend compatible modulators and photodetectors are de...
Hybrid Co-Packaged Receiver Module with pin-Photodiode Chip and DEMUX-IC for 107 Gb/s Data Rates
Receiver Module pin-Photodiode Chip DEMUX-IC Data Rates
2015/7/20
A hybrid co-packaged receiver with pin-photodetector and DEMUX-IC for 107 Gb/s is presented. Well opened demultiplexed eye diagrams at 53.5 Gb/s for 107 Gb/s input and error-free demultiplexing perfor...
Hybrid Flip-Chip Integration of a 40 Gb/s DPSK Receiver Comprising a Balanced Photodetector on a DLI-SOI Board
Hybrid Flip-Chip Integration DPSK Receiver Comprising Balanced Photodetector DLI-SOI Board
2015/8/4
A DPSK receiver concept using flipchip hybrid integration of InP photodetectors on SOI boards with optical decoder is presented. Horizontal waveguiding enables low-cost production for high data rates.