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Description and Performance of a Novel Concept “Single Level” Ceramic Chip Carrier
a Novel Concept Single Level Ceramic Chip Carrier
2010/12/27
Two different designs of ceramic chip carriers are discussed. A carrier capable of being hermetically sealed has been developed which uses a glass seal combined with an epoxy bonded chip. A second car...
Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits
Versatile Packaging Concept Thick Film Hybrids Analog and Digital Circuits
2010/12/27
The design parameters of a packaging concept are described, which allows the realization of a complex electronic module in a closed casing using commercially available components. These are soldered t...
Application-Oriented Description of the Quality of Electronic Components (ppm Concept)
Electronic Components Application-Oriented Description
2010/12/28
Traditionally the production quality of components is described by “acceptable quality levels” (AQL). Agreements, referring to this principle, determine the acceptance or refusal of batches that have ...